"A study on wafer level TSV build-up integration method."

Jae Hak Lee et al. (2013)

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DOI: 10.1109/3DIC.2013.6702355

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-21

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Jae Hak Lee, Hyoung Joon Kim, Jun-Yeob Song, Chang Woo Lee, Tae Ho Ha:
A study on wafer level TSV build-up integration method. 3DIC 2013: 1-4

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