"Consideration of microbump layout for reduction of local bending stress ..."

Hisashi Kino et al. (2015)

> Home

Details and statistics

DOI: 10.1109/3DIC.2015.7334596

access: closed

type: Conference or Workshop Paper

metadata version: 2021-10-14

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/3dic/KinoHTSIFKT15
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/3dic/KinoHTSIFKT15
Hisashi Kino, Hideto Hashiguchi, Seiya Tanikawa, Yohei Sugawara, Shunsuke Ikegaya, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka:
Consideration of microbump layout for reduction of local bending stress due to CTE Mismatch in 3D IC. 3DIC 2015: TS8.26.1-TS8.26.4

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.