"Protective Layer for Collective Die to Wafer Hybrid Bonding."

Fumihiro Inoue et al. (2019)

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DOI: 10.1109/3DIC48104.2019.9058870

access: closed

type: Conference or Workshop Paper

metadata version: 2021-10-14

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  - https://dblp.org/rec/conf/3dic/InoueBSPOKKB19
Fumihiro Inoue, Julien Bertheau, Samuel Suhard, Alain Phommahaxay, Takuya Ohashi, Tetsuro Kinoshita, Yohei Kinoshita, Eric Beyne:
Protective Layer for Collective Die to Wafer Hybrid Bonding. 3DIC 2019: 1-4

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