"Transfer and non-transfer stacking technologies based on chip-to-wafer ..."

Takafumi Fukushima et al. (2015)

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DOI: 10.1109/3DIC.2015.7334578

access: closed

type: Conference or Workshop Paper

metadata version: 2021-02-16

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Takafumi Fukushima, Taku Suzuki, Hideto Hashiguchi, Chisato Nagai, Jichoel Bea, Hiroyuki Hashimoto, Mariappan Murugesan, Kang Wook Lee, Tetsu Tanaka, Kazushi Asami, Yasuhiro Kitamura, Mitsumasa Koyanagi:
Transfer and non-transfer stacking technologies based on chip-to-wafer self-asembly for high-throughput and high-precision alignment and microbump bonding. 3DIC 2015: TS7.4.1-TS7.4.4

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