"Wafer thinning for 3D integration."

Ricardo I. Fuentes (2013)

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DOI: 10.1109/3DIC.2013.6702381

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-21

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Ricardo I. Fuentes:
Wafer thinning for 3D integration. 3DIC 2013: 1-5

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