"Challenges of Cu CMP of TSVs and RDLs fabricated from the backside of a ..."

Jui-Chin Chen et al. (2013)

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DOI: 10.1109/3DIC.2013.6702335

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-21

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Jui-Chin Chen, John H. Lau, Tzu-Chien Hsu, Chien-Chou Chen, Pei-Jer Tzeng, Po-Chih Chang, Chun-Hsien Chien, Yiu-Hsiang Chang, Shang-Chun Chen, Yu-Chen Hsin, Sue-Chen Liao, Cha-Hsin Lin, Tzu-Kun Ku, Ming-Jer Kao:
Challenges of Cu CMP of TSVs and RDLs fabricated from the backside of a thin wafer. 3DIC 2013: 1-5

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