"Twice-etched silicon approach for via-last through-silicon-via with a ..."

Tung Thanh Bui et al. (2015)

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DOI: 10.1109/3DIC.2015.7334611

access: closed

type: Conference or Workshop Paper

metadata version: 2023-09-05

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Tung Thanh Bui, Naoya Watanabe, Masahiro Aoyagi, Katsuya Kikuchi:
Twice-etched silicon approach for via-last through-silicon-via with a Parylene-HT liner. 3DIC 2015: TS8.6.1-TS8.6.4

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