"Chip to wafer copper direct bonding electrical characterization and ..."

Yann Beilliard et al. (2013)

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DOI: 10.1109/3DIC.2013.6702315

access: closed

type: Conference or Workshop Paper

metadata version: 2021-01-21

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  - https://dblp.org/rec/conf/3dic/BeilliardCCMSMSEP13
Yann Beilliard, Perceval Coudrain, Léa Di Cioccio, Stéphane Moreau, Loic Sanchez, Brigitte Montmayeul, Thomas Signamarcheix, Rafael Estevez, Guillaume Parry:
Chip to wafer copper direct bonding electrical characterization and thermal cycling. 3DIC 2013: 1-7

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