"High productivity thermal compression bonding for 3D-IC."

Noboru Asahi et al. (2015)

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DOI: 10.1109/3DIC.2015.7334577

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-21

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Noboru Asahi, Yoshinori Miyamoto, Masatsugu Nimura, Yoshihito Mizutani, Yoshiyuki Arai:
High productivity thermal compression bonding for 3D-IC. 3DIC 2015: TS7.3.1-TS7.3.5

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