"Die-to-Wafer Hybrid Bonding Impact at MM-Wave Frequencies."

Mohammad Alsukour et al. (2024)

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DOI: 10.1109/3DIC63395.2024.10830066

access: closed

type: Conference or Workshop Paper

metadata version: 2025-09-06

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  - https://dblp.org/rec/conf/3dic/AlsukourVFVM0PA24
Mohammad Alsukour, Olivier Valorge, Margot Faure, Loïc Vincent, Victor Milon, Pascal Chevalier, Emmanuel Pistono, Jean-Daniel Arnould, Christophe Dubarry:
Die-to-Wafer Hybrid Bonding Impact at MM-Wave Frequencies. 3DIC 2024: 1-6

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