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P. Jaenen

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2000 – 2009

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2009
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  dblp key:
  - conf/3dic/CivaleTPJADSTB09
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Yann Civale, Deniz Sabuncuoglu Tezcan, Harold G. G. Philipsen, P. Jaenen, Rahul Agarwal, F. Duval, Philippe Soussan, Youssef Travaly, Eric Beyne:
Die stacking using 3D-wafer level packaging copper/polymer through-si via technology and Cu/Sn interconnect bumping. 3DIC 2009: 1-4
2005
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S. Beckx, M. Demand, S. Locorotondo, K. Henson, M. Claes, V. Paraschiv, D. Shamiryan, P. Jaenen, W. Boullart, S. Degendt:
Implementation of high-k and metal gate materials for the 45nm node and beyond: gate patterning development. Microelectron. Reliab. 45(5-6): 1007-1011 (2005)

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