3.2Tb/s Heterogeneous Photonic Integrated Circuit Chip in a Co-Packaged Optics Configuration.

Sun, 01 Jan 2023 00:00:00 +0100

Damien Lambert, Jeff Rahn, Majid Sodagar, Murtaza Askari, Paveen Apiratikul, John Y. Spann, Thang Pham, Yishen Huang, Stephen Krasulick:
3.2Tb/s Heterogeneous Photonic Integrated Circuit Chip in a Co-Packaged Optics Configuration. OFC 2023: 1-3