Microstructural evolutions of Sn-3.0Ag-0.5Cu solder joints during thermal cycling.

Mon, 01 Jan 2018 00:00:00 +0100

J. B. Libot, Joël Alexis, Olivier Dalverny , L. Arnaud, P. Milesi, F. Dulondel:
Microstructural evolutions of Sn-3.0Ag-0.5Cu solder joints during thermal cycling. Microelectron. Reliab. 83: 64-76 (2018)