Mechanical reliability of Au and Cu wire bonds to Al, Ni/Au and Ni/Pd/Au capped Cu bond pads.

Sun, 01 Jan 2006 00:00:00 +0100

Petar Ratchev, Serguei Stoukatch , Bart Swinnen:
Mechanical reliability of Au and Cu wire bonds to Al, Ni/Au and Ni/Pd/Au capped Cu bond pads. Microelectron. Reliab. 46(8): 1315-1325 (2006)