Thermal cycling reliability of SnAgCu and SnPb solder joints: A comparison for several IC-packages.

Mon, 01 Jan 2007 00:00:00 +0100

Bart Vandevelde, Mario Gonzalez , Paresh Limaye , Petar Ratchev, Eric Beyne :
Thermal cycling reliability of SnAgCu and SnPb solder joints: A comparison for several IC-packages. Microelectron. Reliab. 47(2-3): 259-265 (2007)