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ORCIDMichael S. Shur
Person information
- affiliation: Rensselaer Polytechnic Institute,: Troy, NY, USA
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Journal Articles
- 2021
[j11]Naznin Akter
, Masudur R. Siddiquee, Michael S. Shur, Nezih Pala:
AI-Powered Terahertz VLSI Testing Technology for Ensuring Hardware Security and Reliability. IEEE Access 9: 64499-64509 (2021)- [j10]Michael S. Shur:
Pandemic Equation for Describing and Predicting COVID19 Evolution. J. Heal. Informatics Res. 5(2): 168-180 (2021) - [j9]Michael S. Shur, Gregory Aizin, Taiichi Otsuji, Victor Ryzhii:
Plasmonic Field-Effect Transistors (TeraFETs) for 6G Communications. Sensors 21(23): 7907 (2021) - 2020
- [j8]Xueqing Liu, Trond Ytterdal, Michael S. Shur:
Plasmonic FET Terahertz Spectrometer. IEEE Access 8: 56039-56044 (2020) - 2006
- [j7]Victor Ryzhii, Akira Satou, Michael S. Shur:
Plasma Instability and Terahertz Generation in HEMTs Due to Electron Transit-Time Effect. IEICE Trans. Electron. 89-C(7): 1012-1019 (2006) - 2005
- [j6]Michael S. Shur, Arturas Zukauskas:
Solid-State Lighting: Toward Superior Illumination. Proc. IEEE 93(10): 1691-1703 (2005) - 1994
- [j5]Jeff Conger, Andrzej Peczalski, Michael S. Shur:
Modeling frequency dependence of GaAs MESFET characteristics. IEEE J. Solid State Circuits 29(1): 71-76 (1994) - 1991
- [j4]Robert F. Davis, Galina Kelner, Michael S. Shur, John W. Palmour, John A. Edmond:
Thin film deposition and microelectronic and optoelectronic device fabrication and characterization in monocrystalline alpha and beta silicon carbide. Proc. IEEE 79(5): 677-701 (1991) - 1988
- [j3]Tho Truong Vu, Roderick D. Nelson, Gary M. Lee, Peter C. T. Roberts, Kang W. Lee, Stephen K. Swanson, Andrzej Peczalski, William R. Betten, Steven A. Hanka, Max J. Helix, Peter J. Vold, Gi Young Lee, Stephen A. Jamison, Christopher A. Arsenault, Susan M. Karwoski, Barbara A. Naused, Barry K. Gilbert, Michael S. Shur:
Low-power 2K-cell SDFL gate array and DCFL circuits using GaAs self-aligned E/D MESFETs. IEEE J. Solid State Circuits 23(1): 224-238 (1988) - 1986
- [j2]Andrzej Peczalski, Michael S. Shur, Choong H. Hyun, Kang W. Lee, Tho Truong Vu:
Design Analysis of GaAs Direct Coupled Field Effect Transistor Logic. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 5(2): 266-273 (1986) - [j1]Choong H. Hyun, Michael S. Shur, Nicholas C. Cirillo Jr.:
Simulation and Design Analysis of (A1Ga)As/GaAs MODFET Integrated Circuits. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 5(2): 284-292 (1986)
Conference and Workshop Papers
- 2022
- [c13]Michael S. Shur:
Generalized Pandemic Equation for Monitoring COVID-19. CSCI 2022: 1800-1802 - 2020
- [c12]Michael S. Shur:
Describing and Predicting COVID19 Evolution Using Pandemic Equation. IEEE BigData 2020: 5822-5824 - [c11]Naznin Akter, Mustafa Karabiyik, Michael S. Shur, John Suarez, Nezih Pala:
AI Powered THz VLSI Testing Technology. NATW 2020: 1-5 - 2019
- [c10]Xueqing Liu, Michael S. Shur:
An Efficient TCAD Model for TeraFET Detectors. RWS 2019: 1-4 - 2018
- [c9]Michael S. Shur, John Suarez:
Nanoscale silicon mosfet response to THz radiation for testing VLSI. NATW 2018: 1-6 - 2017
- [c8]Michael S. Shur, Xueqing Liu, Sergey Rumyantsev, V. Kachorovski:
Heterodyne phase sensitive terahertz spectrometer. IEEE SENSORS 2017: 1-3 - [c7]Michael S. Shur, Xueqing Liu, Sergey Rumyantsev, Greg Rupper, Sergey Rudin:
Low-frequency noise in terahertz plasmonic field effect transistor sensors. IEEE SENSORS 2017: 1-3 - 2016
- [c6]Michael S. Shur:
Terahertz compact SPICE model. MIXDES 2016: 27-31 - 2014
- [c5]Remis Gaska, Mikhail Gaevski, Jianyu Deng, Rakesh Jain, Grigory Simin, Michael S. Shur:
Novel AlInN/GaN integrated circuits operating up to 500 °C. ESSDERC 2014: 142-145 - 2009
- [c4]Michael S. Shur:
Terahertz sensing technology. ACM Great Lakes Symposium on VLSI 2009: 537-538 - 2005
- [c3]Michael S. Shur:
Terahertz technology: devices and applications. ESSCIRC 2005: 13-21 - 2000
- [c2]J. Sinius, Remis Gaska, Michael S. Shur:
Flexible semiconductor films for sensitive skin. IROS 2000: 1511-1515 - [c1]Michael S. Shur, Tor A. Fjeldly, Trond Ytterdal:
Transistor Modeling for the VDSM Era. ISQED 2000: 37-44
Data and Artifacts
- 2018
- [d1]Xueqing Liu, Michael S. Shur:
THz_SPICE_model_2018. IEEE DataPort, 2018
Coauthor Index
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