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ORCIDSeryeong Kim
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2020 – today
- 2026
[j4]Seokchan Song
, Seryeong Kim, Wonhoon Park, Jongjun Park, Sanghyuk An, Gwangtae Park, Minseo Kim, Hoi-Jun Yoo:
IRIS: An Energy-Efficient Spatial Computing SoC for Real-Time Interactive Rendering and Modeling With Surface-Aware 3-D Gaussian Splatting. IEEE J. Solid State Circuits 61(1): 183-196 (2026)- [c11]Jiwon Choi, Seongyon Hong, Wooyoung Jo, Wonhoon Park, Sunjoo Whang, Seryeong Kim, Jongjun Park, Sangjin Kim, Hoi-Jun Yoo:
MicroXPU: An Energy-Efficient Low-bit LLM Accelerator with Microscaling Format-Tailored Digital Compute-in-Memory Macro. COOL CHIPS 2026: 1-3 - [c10]Seryeong Kim, Jongjun Park, Hyungnam Joo, Sangmyoung Lee, Wonhoon Park, Seokchan Song, Junha Ryu, Gwangtae Park, Sangjin Kim, Jiwon Choi, Seongyon Hong, Wooyoung Jo, Hyeonrae Kim, Hoi-Jun Yoo:
A Real-Time and Energy-Efficient 3D Gaussian Splatting-based Geometric and Semantic Mapping Processor with 2-level Redundancy Handling for Embodied Agents. COOL CHIPS 2026: 1-3 - [c9]Jongjun Park, Seryeong Kim, Seokchan Song, Wonhoon Park, Junha Ryu, Jiwon Choi, Hoi-Jun Yoo:
COOL-Splat: A HW/SW Co-optimized Online 3D Gaussian Splatting Modeling Accelerator for Energy-Efficient 3D Modeling on Mobile Devices. COOL CHIPS 2026: 1-3 - [c8]Yujin Moon, Jiwon Choi, Seryeong Kim, Wonhoon Park, Wooyoung Jo, Yuseon Choi, Sunjoo Whang, Hoi-Jun Yoo:
A 198.7 μJ/token Block Diffusion LLM Processor with Mask Token Similarity-Based Activation Reuse. ISCAS 2026: 1591-1595 - 2025
- [j3]Seryeong Kim, Seokchan Song, Wonhoon Park, Junha Ryu, Gwangtae Park, Sangyeob Kim, Soyeon Kim, Donghyeon Han, Hoi-Jun Yoo:
NeRF-Navi: An Energy-Efficient NeRF 3-D Path Planning Processor With Reconfigurable Approximate/Accurate Bit Offloading Core. IEEE J. Solid State Circuits 60(11): 4154-4166 (2025) - [j2]Sangmyoung Lee, Seryeong Kim, Jongjun Park, Youngjin Moon, Minsung Kim, Junha Ryu, Hoi-Jun Yoo, Donghyeon Han:
A 227.1 TOPS/W High Energy-Efficiency PNN-Based 3-D Object Recognition Processor With Spiking Neural Network for Edge Device. IEEE Trans. Circuits Syst. II Express Briefs 72(11): 1610-1614 (2025) - [c7]Hyungnam Joo, Junha Ryu, Seryeong Kim, Jongjun Park, Hoi-Jun Yoo:
A Real-Time 3DGS-SLAM with Voxel-based Memory Management and Region of Interest-based Pixel-wise Skipping Architecture on Edge Device. AICAS 2025: 1-5 - [c6]Seokchan Song, Seryeong Kim, Wonhoon Park, Jongjun Park, Sanghyuk An, Gwangtae Park, Minseo Kim, Hoi-Jun Yoo:
IRIS: A 8.55 mJ/frame Spatial Computing SoC for Real-time Interactable-Rendering and Surface-aware-Modeling with 3D Gaussian Splatting. HCS 2025: 1 - [c5]Hyungnam Joo, Seryeong Kim, Jongjun Park, Junha Ryu, Hoi-Jun Yoo:
A 51.2 fps Real-Time 3DGS-SLAM Accelerator using Diagonal Feeding with Symmetric Alpha Reuse and Voxel-based 3D Gaussian Cache Management. ISCAS 2025: 1-5 - [c4]Seokchan Song, Seryeong Kim, Wonhoon Park, Jongjun Park, Sanghyuk An, Gwangtae Park, Minseo Kim, Hoi-Jun Yoo:
IRIS: A 8.55mJ/frame Spatial Computing SoC for Interactable Rendering and Surface-Aware Modeling with 3D Gaussian Splatting. ISSCC 2025: 1-3 - 2024
- [j1]Jongjun Park, Seryeong Kim, Wonhoon Park, Seokchan Song, Hoi-Jun Yoo:
An Energy-Efficient CNN/Transformer Hybrid Neural Semantic Segmentation Processor With Chunk-Based Bit Plane Data Compression and Similarity-Based Token-Level Skipping Exploitation. IEEE Trans. Circuits Syst. I Regul. Pap. 71(12): 5482-5493 (2024) - [c3]Jongjun Park, Seryeong Kim, Wonhoon Park, Seokchan Song, Hoi-Jun Yoo:
A 3.55 mJ/frame Energy-efficient Mixed-Transformer based Semantic Segmentation Accelerator for Mobile Devices. ISCAS 2024: 1-5 - [c2]Seryeong Kim, Seokchan Song, Wonhoon Park, Junha Ryu, Sangyeob Kim, Gwangtae Park, Soyeon Kim, Hoi-Jun Yoo:
NeRF-Navi: A 93.6-202.9µJ/task Switchable Approximate-Accurate NeRF Path Planning Processor with Dual Attention Engine and Outlier Bit-Offloading Core. VLSI Technology and Circuits 2024: 1-2 - 2023
- [c1]Seryeong Kim, Soyeon Kim, Soyeon Um, Sangjin Kim, Zhiyong Li, Sangyeob Kim, Wooyoung Jo, Hoi-Jun Yoo:
A Reconfigurable 1T1C eDRAM-based Spiking Neural Network Computing-In-Memory Processor for High System-Level Efficiency. ISCAS 2023: 1-5
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