Study on the methods to measure the junction-to-case thermal resistance of IGBT modules and press pack IGBTs.

Sun, 01 Jan 2017 00:00:00 +0100

Erping Deng , Zhibin Zhao, Peng Zhang, Jinyuan Li, Yongzhang Huang:
Study on the methods to measure the junction-to-case thermal resistance of IGBT modules and press pack IGBTs. Microelectron. Reliab. 79: 248-256 (2017)