BCB-to-oxide bonding technology for 3D integration.

Sun, 01 Jan 2012 00:00:00 +0100

S. L. Lin, W. C. Huang, C. T. Ko, Kuan-Neng Chen :
BCB-to-oxide bonding technology for 3D integration. Microelectron. Reliab. 52(2): 352-355 (2012)