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ORCIDMicroelectronics Reliability, Volume 79
Volume 79, December 2017
- Daisuke Fukushi, Akito Sasaki, Hideaki Hirabayashi, Masaaki Kitano
:
Effect of oxygen vacancy in tungsten oxide on the photocatalytic activity for decomposition of organic materials in the gas phase. 1-4 - Kiyoshi Mizuuchi, Kanryu Inoue, Yasuyuki Agari:
Trend of the development of metal-based heat dissipative materials. 5-19 - Forrest Baber, Ibrahim Guven:
Solder joint fatigue life prediction using peridynamic approach. 20-31 - David T. Chu, Yi-Cheng Chu, Jie-An Lin, Yi-Ting Chen, Chun-Chieh Wang, Yen-Fang Song, Cheng-Cheng Chiang, Chih Chen, King-Ning Tu:
Growth competition between layer-type and porous-type Cu3Sn in microbumps. 32-37 - Cheng Chen, Fengze Hou, Fengman Liu, Qian She, Liqiang Cao, Lixi Wan:
Thermo-mechanical reliability analysis of a RF SiP module based on LTCC substrate. 38-47 - Xunfei Zhou, Sheng-Jen Hsieh, Bo Peng, Daniel Hsieh:
Cycle life estimation of lithium-ion polymer batteries using artificial neural network and support vector machine with time-resolved thermography. 48-58 - Meng Chuan Lee, Hin Yong Wong:
Investigation on X-ray irradiation on nanoscale nitride based charge trapping flash memory devices. 59-68 - A. M. Najib, Mohd Zulkifly Abdullah, Abdullah Aziz Saad, Z. Samsudin, F. Che Ani:
Numerical simulation of self-alignment of chip resistor components for different silver content during reflow soldering. 69-78 - Haider Muhi Abbas, Basel Halak, Mark Zwolinski:
BTI mitigation by anti-ageing software patterns. 79-90 - Naoyuki Nishikawa, Seira Yamaguchi, Keisuke Ohdaira:
Direct observation of changes in the effective minority-carrier lifetime of SiNx-passivated n-type crystalline-silicon substrates caused by potential-induced degradation and recovery tests. 91-95 - Pawel Górecki, Krzysztof Górecki, Janusz Zarebski:
Modelling the temperature influence on dc characteristics of the IGBT. 96-103 - Peter Meszmer, Raul D. Rodriguez, Evgeniya Sheremet, Dietrich R. T. Zahn, Bernhard Wunderle:
Stress imaging in structural challenging MEMS with high sensitivity using micro-Raman spectroscopy. 104-110 - Bruna Cardoso Paz, Renan Trevisoli Doria, Mikaël Cassé, Sylvain Barraud, Gilles Reimbold, Maud Vinet, Olivier Faynot, Marcelo Antonio Pavanello:
Harmonic distortion analysis of triple gate SOI nanowire MOSFETS down to 100 K. 111-118 - Tadahiro Shibutani, Jing Wen Sun:
Nucleation and shrinkage of defects on the surface of tin induced by local strain distribution. 119-123 - Jie Wu, Songbai Xue, Jingwen Wang, Jianxin Wang:
Comparative studies on microelectronic reliability issue of Sn whisker growth in Sn-0.3Ag-0.7Cu-1Pr solder under different environments. 124-135 - Yanlin Li, Kuei-Shu Chang-Liao, Yu-Wei Chang, Tse-Jung Huang, Chen-Chien Li, Zhao-Chen Gu, Po-Yen Chen, Tzung-Yu Wu, Jiayi Huang, Fu-Chuan Chu, Shih-Han Yi:
Improved reliability characteristics of Ge MOS devices by capping Hf or Zr on interfacial layer. 136-139 - Hadiza Ahmad Abubakar, Dino Isa, Wong Yee Wan:
Comparing the degradation effect of a 'two-cell' Supercapacitor-module with and without voltage equalization circuit(s) under experimental self-discharge and load cycling tests. 140-148 - Yao Ma, Pengfei Xu, Mingyue Guan, Filippo Boi, Gao Bo, Min Gong, Xue Wu, Yuxin Wang, Hua Wang, ZengQiang Niao:
Analysis of deep level defects in bipolar junction transistors irradiated by 2 MeV electrons. 149-152 - Morteza Khoshvaght-Aliabadi, Seyedmasoud Hassani, Seyed Hossein Mazloumi, M. Nekoei:
Effects of nooks configuration on hydrothermal performance of zigzag channels for nanofluid-cooled microelectronic heat sink. 153-165 - Fan Liu, Lei Su, Mengying Fan, Jian Yin, Zhenzhi He, Xiangning Lu:
Using scanning acoustic microscopy and LM-BP algorithm for defect inspection of micro solder bumps. 166-174 - Ben Cornelius, Shay Treivish, Yair Rosenthal, Michael G. Pecht:
The phenomenon of tin pest: A review. 175-192 - Somayeh Fotoohi, Saeed Haji-Nasiri:
Transfer matrix model of multilayer graphene nanoribbon interconnects. 193-200 - Aihua Dong, Javier A. Salcedo, Srivatsan Parthasarathy, Yuanzhong Paul Zhou, Sirui Luo, Jean-Jacques Hajjar, Juin J. Liou:
ESD protection structure with reduced capacitance and overshoot voltage for high speed interface applications. 201-205 - Ee-Hua Wong, Johan Liu:
Interface and interconnection stresses in electronic assemblies - A critical review of analytical solutions. 206-220 - Youhu Zhao, Enrico Zio, Guicui Fu:
Remaining storage life prediction for an electromagnetic relay by a particle filtering-based method. 221-230 - Bin Lu, Hongliang Lu, Yuming Zhang, Yimen Zhang, Xiaoran Cui, Chengji Jin, Chen Liu:
Improved analytical model of surface potential with modified boundary conditions for double gate tunnel FETs. 231-238 - Dheeraj Kumar Sinha, Amitabh Chatterjee:
SPICE level implementation of physics of filamentation in ESD protection devices. 239-247 - Erping Deng, Zhibin Zhao, Peng Zhang, Jinyuan Li, Yongzhang Huang:
Study on the methods to measure the junction-to-case thermal resistance of IGBT modules and press pack IGBTs. 248-256 - Xue Kang, Yiping Wang, Qunwu Huang, Yong Cui, Chen Wang, Chen Wen, Jiangyang Fan:
Phase-change immersion cooling high power light emitting diodes and heat transfer improvement. 257-264 - M. Lisiansky, Y. Raskin, Y. Roizin, B. Meyler, S. Yofis, Y. Shneider:
Peculiarities of hole trapping in Al2O3-SiO2 gate dielectric stack. 265-269 - Hua-Chiang Wen, Wu-Ching Chou, Shiuan Huei Lin, Don Son Jiang:
Nanomechanical properties of Ag solder bumps doped with Pd and Au. 270-275 - A. A. Dakhel:
Improving carrier mobility with vanadium doping of transparent conducting CdO. 276-280 - Giulio Torrente, Jean Coignus, Alexandre Vernhet, Jean-Luc Ogier, David Roy, Gérard Ghibaudo:
Physically-based evaluation of aging contributions in HC/FN-programmed 40 nm NOR Flash technology. 281-287 - A. Ben Kabaar, Cyril Buttay, O. Dezellus, R. Estevez, Anthony Gravouil, Laurent Gremillard:
Characterization of materials and their interfaces in a direct bonded copper substrate for power electronics applications. 288-296 - Luka Kljucar, Mario Gonzalez, Kristof Croes, Ingrid De Wolf, Joke De Messemaeker, Gayle Murdoch, Philip Nolmans, Joeri De Vos, Jürgen Bömmels, Eric Beyne, Zsolt Tökei:
Impact of via density and passivation thickness on the mechanical integrity of advanced Back-End-Of-Line interconnects. 297-305 - Ling-Ling Li, Yu-Han Ren, Ching-Hsin Wang, Ching-Tsung Jen:
A new method to estimate the state of charge of the green battery. 306-313 - Renuka Vallabhaneni, Ehsan Izadi, Carl R. Mayer, C. Shashank Kaira, Sudhanshu S. Singh, Jagannathan Rajagopalan, Nikhilesh Chawla:
In situ tensile testing of tin (Sn) whiskers in a focused ion beam (FIB)/scanning electron microscope (SEM). 314-320 - Dong-Woon Han, Ho-Kyung Kim:
Effect of normal forces on fretting corrosion of tin-coated electrical contacts. 321-327 - Dong Hyun Park, Sojin Shin, Yeong K. Kim:
Module packaging effects on MEMS airbag sensor performance for automobiles. 328-335 - M. S. Haslinda, Aizat Abas, F. Che Ani, A. Jalar, Abdullah Aziz Saad, Mohd Zulkifly Abdullah:
Discrete phase method particle simulation of ultra-fine package assembly with SAC305-TiO2 nano-reinforced lead free solder at different weighted percentages. 336-351 - Hassen M. Ouakad, Jihad E. AlQasimi:
Reliability of MEMS shallow arches based actuator under the combined effect of mechanical shock and electric loads. 352-359
- Márta Rencz:
Thermal investigations of integrated circuits and systems, THERMINIC'16. 360 - Lorenzo Codecasa, Vincenzo d'Alessandro, Alessandro Magnani, Niccolò Rinaldi, Andre G. Metzger, Robin Bornoff, John Parry:
Partition-based approach to parametric dynamic compact thermal modeling. 361-370 - Lorenzo Codecasa, Vincenzo d'Alessandro, Alessandro Magnani, Niccolò Rinaldi:
3-D thermal models calibration by parametric dynamic compact thermal models. 371-379 - Samson Melamed, Naoya Watanabe, Shunsuke Nemoto, Haruo Shimamoto, Katsuya Kikuchi, Masahiro Aoyagi:
Thermal impact of extreme die thinning in bump-bonded three-dimensional integrated circuits. 380-386 - László Pohl, Soma Ur, János Mizsei:
Thermoelectrical modelling and simulation of devices based on VO2. 387-394 - Attahir Murtala Aliyu, Alberto Castellazzi:
Measuring structure functions of power devices in inverters. 395-404 - Marcin Janicki, Tomasz Torzewicz, Agnieszka Samson, Tomasz Raszkowski, Artur Sobczak, Mariusz Zubert, Andrzej Napieralski:
Experimental investigation of discrete air cooled device thermal resistance dependence on cooling conditions. 405-409 - Marco Ranieri, Diego Alberto, Hélène Piret, Viviane Cattin:
Electronic module for the thermal monitoring of a Li-ion battery cell through the electrochemical impedance estimation. 410-415 - Konstantin O. Petrosyants, Igor A. Kharitonov, Sergey V. Lebedev, Lev M. Sambursky, Sergey O. Safonov, Veniamin G. Stakhin:
Electrical characterization and reliability of submicron SOI CMOS technology in the extended temperature range (to 300 °C). 416-425 - G. Casano, S. Piva:
Experimental investigation of a Peltier cells cooling system for a Switch-Mode Power Supply. 426-432 - Charles-Alexis Lefebvre, Jose Luis Montero, Leire Rubio:
Implementation of a fast relative digital temperature sensor to achieve thermal protection in Zynq SoC technology. 433-439 - Krzysztof Górecki, Przemyslaw Ptak:
Modelling LED lamps in SPICE with thermal phenomena taken into account. 440-447 - Jozsef Hegedus, Gusztáv Hantos, András Poppe:
Light output stabilisation of LED based streetlighting luminaires by adaptive current control. 448-456 - Anton E. Chernyakov, Andrey V. Aladov, Ivan A. Kalashnikov, Alexander L. Zakgeim, Vitaliy I. Smirnov, Viacheslav Andreevich Sergeev:
Experimental study of electroluminescence and temperature distribution in high-power AlGaInN LEDs & LED arrays. 457-461 - Lisa Mitterhuber, Stefan Defregger, René Hammer, Julien Magnien, Franz Schrank, Stefan Hörth, Matthias Hutter, Elke Kraker:
Validation methodology to analyze the temperature-dependent heat path of a 4-chip LED module using a finite volume simulation. 462-472 - Kaj Lampio, Reijo Karvinen:
Optimization of convectively cooled heat sinks. 473-479 - Gábor Takács, György Bognár, Eniko Bándy, Gábor Rózsás, Péter G. Szabó:
Fabrication and characterization of microscale heat sinks. 480-487 - Piotr Zajac, Cezary Maj, Andrzej Napieralski:
Peak temperature reduction by optimizing power density distribution in 3D ICs with microchannel cooling. 488-498 - Lázár Jani, András Poppe:
Framework for thermal-aware verification of digital and mixed signal systems. 499-508 - Cosmin-Sorin Plesa, Marius Neag, Cristian Boianceanu, Andrei Negoita:
Design methodology for over-temperature and over-current protection of an LDO voltage regulator by using electro-thermal simulations. 509-516 - Avisek Roy, Ferenc Ender, Mehdi Azadmehr, Knut E. Aasmundtveit:
CMOS micro-heater design for direct integration of carbon nanotubes. 517-525 - Zygimantas Staliulionis, Sankhya Mohanty, Masoud Jabbari, Jesper Henri Hattel:
Mathematical modelling of moisture transport into an electronic enclosure under non-isothermal conditions. 526-532 - E. Liu, Thomas Zahner, Sebastian Besold, Bernhard Wunderle, Gordon Elger:
Location resolved transient thermal analysis to investigate crack growth in solder joints. 533-546 - N. van Veen, W. Luiten:
Force and collapsed shape of a liquid solder bump under load. 547-553
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