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ORCIDMicroelectronics Journal, Volume 176
Volume 176, 2026
- Wenhao Ren, Xuan Guo
, Hanbo Jia, Fangyuan Xu, Jingyuan Xu, Fangning Song, Kai Sun, Xinyu Liu:
A 12-bit 1.25 GS/s Ping-Pong pipelined-SAR ADC employing a gain-enhanced ring amplifier with Miller negative capacitance. 107329 - Ziteng Chen, Zhetao Ding, Yukan Du, Zheyuan Fei, Wanyuan Qu:
A 10-MHz four-phase FCML buck converter with ripple-injection-based AOT control for fast transient mobile power delivery. 107330 - Yan Pan, Xiaoyun Huang, Hongyu Tang, Boying Meng, Fang Wang, Kai Xu:
Transfer-learning-enabled modeling of DEMOS devices for scalable semiconductor design with wafer-level validation. 107341 - Liuxue Sun, Yuchen Liu, Yiyang Wang, Haonan Huang, Guolong Fu, Yanbo Zhang:
A 10-bit 100-MS/s SAR ADC with compact reference ripple cancellation. 107342 - Chengzhi Zhang, Yongqing Leng, Xin Qiu, Ming Hui, Ruimiao Zhang:
A 22-26 GHz, 27.2-dBm CMOS power amplifier using parasitic-compensated stacked transistors and transformer power combining. 107349 - Hongyi Kang, Zhiyu Wang, Jingyu Zhou, Haotian Wu, Zichen Guo, Annan Xu, Xi Guo, Chenge Wang, Jiongjiong Mo, Faxin Yu:
Design and fabrication of an ultra-wideband RF front-end module based on three-dimensional heterogeneous integration technology. 107350 - Xiaojing Zha, Qianhuo Wu, Lunyao Wang, Yinshui Xia:
FeMSL: FeFET-based in-memory state logic design. 107351 - Xiaotong Shu, Zhenzhi He, Jiayi Yuan, Guo Ye, Tianchi Chen, Lianchao Sheng, Xiangning Lu:
Wafer-YOLO: A lightweight object detection network for wafer inspection. 107352 - Wei Cheng, Zhihao Zhang, Shuting Jiang, Gary Zhang:
A fully integrated 5.9-7.2 GHz dual-mode low-noise amplifier using SNIM and broadband matching techniques. 107353 - Jingyu Zhou, Haotian Wu, Hongyi Kang, Chen Jin, Qihe Song, Xu Ding, Zhiyu Wang, Wei Chen, Faxin Yu:
A switchless X/K dual-wideband GaAs MMIC power amplifier with series-resonance-optimized output matching network for load effect mitigation. 107354 - Qingping Zhang, Wenfa Zhan:
A DfT architecture with automatic scan chain configuration for 3D-stacked ICs. 107355 - Mingxing Du, Xinyi Peng, Jianxiong Yang:
A bridge-level IGBT junction temperature monitoring method via the peak of collector-emitter voltage change rate during turn-off. 107356 - Xiaohong Zhong, Huanlin Xie, Kejing Chen, Chunbing Guo:
A 12-bit 200-MS/s pipelined SAR ADC with a closed-loop inverter-based residue amplifier and GRO-based time-domain quantization. 107357 - Jiangping He, Hao Liu, Hao-Tian Zhi, Sheng-Hong Xu, Jian-Cheng Zhou, Daoxun Xie, Wei Li:
A novel method for audible noise suppression and enhanced efficiency using hybrid buck-pseudo-boost converter. 107371
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