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ORCIDInternational Conference on Tangible, Embedded, and Embodied Interaction (TEI)
International Conference on Tangible and Embedded Interaction (TEI)
20th TEI 2026: Chicago, IL, USA
- Proceedings of the Twentieth International Conference on Tangible, Embedded, and Embodied Interaction, TEI 2026, Chicago, IL, USA, March 8-11, 2026. ACM 2026, ISBN 979-8-4007-1868-7 [contents]
19th TEI 2025: Bordeaux/Talence, France
- Proceedings of the Nineteenth International Conference on Tangible, Embedded, and Embodied Interaction, TEI 2025, Bordeaux/Talence, France, March 4-7, 2025. ACM 2025, ISBN 979-8-4007-1197-8 [contents]
18th TEI 2024: Cork, Ireland
- Luigina Ciolfi, Trevor Hogan, Tanja Döring, Tom Jenkins, Jelle van Dijk, Samuel Huron, Zhuying Li, David Coyle, Beat Signer:
Proceedings of the Eighteenth International Conference on Tangible, Embedded, and Embodied Interaction, TEI 2024, Cork, Ireland, February 11-14, 2024. ACM 2024 [contents]
17th TEI 2023: Warsaw, Poland
- Proceedings of the Seventeenth International Conference on Tangible, Embedded, and Embodied Interaction, TEI 2023, Warsaw, Poland, 26 February 2023- 1 March 2023. ACM 2023, ISBN 978-1-4503-9977-7 [contents]
16th TEI 2022: Daejeon, Korea
- TEI '22: Sixteenth International Conference on Tangible, Embedded, and Embodied Interaction, Daejeon, Republic of Korea, February 13 - 16, 2022. ACM 2022, ISBN 978-1-4503-9147-4 [contents]
15th TEI 2021: Online Event / Salzburg, Austria
- Raphael Wimmer, Martin Kaltenbrunner
, Martin Murer, Katrin Wolf, Ian Oakley:
TEI '21: Fifteenth International Conference on Tangible, Embedded, and Embodied Interaction, Online Event / Salzburg, Austria, February 14-19, 2021. ACM 2021, ISBN 978-1-4503-8213-7 [contents]
14th TEI 2020: Sydney, NSW, Australia
- Elise van den Hoven, Lian Loke, Orit Shaer, Jelle van Dijk, Andrew L. Kun:
TEI '20: Fourteenth International Conference on Tangible, Embedded, and Embodied Interaction, Sydney, NSW, Australia, February 9-12, 2020. ACM 2020, ISBN 978-1-4503-6107-1 [contents]
13th TEI 2019: Tempe, AZ, USA
- Stacey Kuznetsov, Daniel Saakes, Ron Wakkary, Luc Geurts, Lauren Hayes, Manfred Lau:
Proceedings of the Thirteenth International Conference on Tangible, Embedded, and Embodied Interaction, TEI 2019, Tempe, AZ, USA, March 17-20, 2019. ACM 2019, ISBN 978-1-4503-6196-5 [contents]
12th TEI 2018: Stockholm, Sweden
- Ylva Fernaeus, Donald McMillan, Martin Jonsson, Audrey Girouard, Jakob Tholander:
Proceedings of the Twelfth International Conference on Tangible, Embedded, and Embodied Interaction, TEI 2018, Stockholm, Sweden, March 18-21, 2018. ACM 2018 [contents]
11th TEI 2017: Yokohama, Japan
- Masa Inakage, Hiroshi Ishii, Ellen Yi-Luen Do, Jürgen Steimle, Orit Shaer, Kai Kunze, Roshan Lalintha Peiris:
Proceedings of the Tenth International Conference on Tangible, Embedded, and Embodied Interaction, TEI 2017, Yokohama, Japan, March 20-23, 2017. ACM 2017, ISBN 978-1-4503-4676-4 [contents]
10th TEI 2016: Eindhoven, The Netherlands
- Saskia Bakker, Caroline Hummels, Brygg Ullmer, Luc Geurts, Bart Hengeveld, Daniel Saakes, Mendel Broekhuijsen:
Proceedings of the TEI '16: Tenth International Conference on Tangible, Embedded, and Embodied Interaction, Eindhoven, The Netherlands, February 14-17, 2016. ACM 2016, ISBN 978-1-4503-3582-9 [contents]
9th TEI 2015: Stanford, California, USA
- Bill Verplank, Wendy Ju, Alissa Nicole Antle, Ali Mazalek, Florian 'Floyd' Mueller:
Proceedings of the Ninth International Conference on Tangible, Embedded, and Embodied Interaction, TEI '15, Stanford, California, USA, January 15-19, 2015. ACM 2015, ISBN 978-1-4503-3305-4 [contents]
8th TEI 2014: Munich, Germany
- Andreas Butz, Saul Greenberg, Saskia Bakker, Lian Loke, Alexander De Luca:
Eighth International Conference on Tangible, Embedded, and Embodied Interaction, TEI'14, Munich, Germany, February 16-19, 2014. ACM 2014, ISBN 978-1-4503-2635-3 [contents]
7th TEI 2013: Barcelona, Spain
- Sergi Jordà, Narcís Parés:
Seventh International Conference on Tangible, Embedded, and Embodied Interaction, TEI'13, Barcelona, Spain, February 10-13, 2013. ACM 2013, ISBN 978-1-4503-1898-3 [contents]
6th TEI 2012: Kingston, Ontario, Canada
- Roel Vertegaal, Stephen N. Spencer, Ylva Fernaeus, Audrey Girouard, Sergi Jordà:
Proceedings of the 6th International Conference on Tangible and Embedded Interaction 2012, Kingston, Ontario, Canada, February 19-22, 2012. ACM 2012, ISBN 978-1-4503-1174-8 [contents]
5th TEI 2011: Funchal, Madeira, Portugal
- Mark D. Gross, Nuno Jardim Nunes, Ellen Yi-Luen Do, Stephen A. Brewster, Ian Oakley:
Proceedings of the 5th International Conference on Tangible and Embedded Interaction 2011, Funchal, Madeira, Portugal, January 22-26, 2011. ACM 2011, ISBN 978-1-4503-0478-8 [contents]
4th TEI 2010: Cambridge, MA, USA
- Marcelo Coelho, Jamie Zigelbaum, Hiroshi Ishii, Robert J. K. Jacob, Pattie Maes, Thomas Pederson, Orit Shaer, Ron Wakkary:
Proceedings of the 4th International Conference on Tangible and Embedded Interaction 2010, Cambridge, MA, USA, January 24-27, 2010. ACM 2010, ISBN 978-1-60558-841-4 [contents]
3rd TEI 2009: Cambridge, UK
- Nicolas Villar, Shahram Izadi, Mike Fraser, Steve Benford:
Proceedings of the 3rd International Conference on Tangible and Embedded Interaction 2009, Cambridge, UK, February 16-18, 2009. ACM 2009, ISBN 978-1-60558-493-5 [contents]
2nd TEI 2008: Bonn, Germany
- Albrecht Schmidt, Hans Gellersen, Elise van den Hoven, Ali Mazalek, Paul Holleis, Nicolas Villar:
Proceedings of the 2nd International Conference on Tangible and Embedded Interaction 2008, Bonn, Germany, February 18-20, 2008. ACM 2008, ISBN 978-1-60558-004-3 [contents]
1st TEI 2007: Baton Rouge, Louisiana, USA
- Brygg Ullmer, Albrecht Schmidt:
Proceedings of the 1st International Conference on Tangible and Embedded Interaction 2007, Baton Rouge, Louisiana, USA, February 15-17, 2007. ACM 2007, ISBN 978-1-59593-619-6 [contents]
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