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ORCID22nd Hot Chips Symposium 2010: Stanford, CA, USA
- 2010 IEEE Hot Chips 22 Symposium, Stanford, CA, USA, August 22-24, 2010. IEEE 2010, ISBN 978-1-4673-8875-7
- Vladimir Stojanovic:
Silicon photonics and memories. 1-50 - Dheemanth Nagaraj, Sailesh Kottapalli:
Westmere-EX: A 20 thread server CPU. 1-18 - Michael S. Floyd, Bishop Brock, Malcolm S. Ware, Karthick Rajamani, Alan J. Drake, Charles Lefurgy, Lorena Pesantez:
Adaptive energy management features of the POWER7TM processor. 1-18 - Rune Jensen, Bob Drehmel:
The new Xbox 360 250GB CPU GPU SoC. 1-17 - Al Davis:
Photonics and future datacenter networks. 1-38 - Jim Johnston:
Solving 4G challenges for pico, micro and macrocell platforms. 1-24 - Forest Baskett, Craig Barratt, Leo Li, Tom Malloy, Ford Tamer:
Panel session Asia: Partner or competitor? 1-2 - Jeffrey D. Brown, Sandra Woodward, Brian Bass, Charlie Johnson:
The IBM power edge of Network™ processor: A wire-speed system-on-a-chip with 16 Power™ cores / 64 threads and optimized HW acceleration. 1-20 - Brian Welch:
Silicon photonics: Optical connectivity at 25 Gbps and beyond. 1-19 - Raminda Madurawe:
3D FPGA & 3D ASIC worlds first unified 3D IC design platform. 1-16 - Jim Handy:
The inevitable rise of NVM in computing. 1-29 - Gilbert Hendry, Keren Bergman:
Hybrid on-chip data networks. 1-49 - David Petrou:
Search by sight: Google™ goggles. 1-48 - L. Baba Arimilli, Steve Baumgartner, Scott Clark, Daniel Dreps, David W. Siljenberg, Andrew Maki:
The IBM POWER7 HUB module: A terabyte interconnect switch for high-performance computer systems. 1-33 - Ashok V. Krishnamoorthy:
"Overview of short-reach optical interconnects: From VCSELs to silicon nanophotonics". 1-31 - Olav Lindtjorn, Robert G. Clapp, Oliver Pell, Oskar Mencer, Michael J. Flynn:
Surviving the end of scaling of traditional micro processors in HPC. 1-47 - Rich Freitas:
Storage class memory: Technology, systems and applications. 1-37 - Burkhard Huhnke:
Looking at transportation in new ways. 1-75 - Saied Tehrani:
Status and prospect for MRAM technology. 1-23 - Marcello Coppola:
Spidergon STNoC: The technology that adds value to your System. 1-39 - Frankie Liu:
Optical interconnect circuits: Some design considerations. 1-29 - Nathan Goulding, Jack Sampson, Ganesh Venkatesh, Saturnino Garcia, Joe Auricchio, Jonathan Babb, Michael B. Taylor, Steven Swanson
:
GreenDroid: A mobile application processor for a future of dark silicon. 1-39 - Dan Mansur, Sergey Y. Shumarayev:
Introducing 28-nm stratix VFPGAs: Built for bandwidth. 1-23 - Dave Hill, Muntaquim Chowdhury:
Westmere Xeon-56xx "Tick" CPU. 1-38 - Mike Butler:
"Bulldozer" a new approach to mult ithreaded compute performance. 1-17 - Brad Burgess:
"Bobcat" AMD's new low power x86 core architecture. 1-20 - Andrew Alduino:
Demonstration of a high speed 4-channel integrated silicon photonics WDM link with hybrid silicon lasers. 1-29 - Paul Kirsch:
Memory overview and RRAM materials development at SEMATECH. 1-21 - Bill Lynch, Sailesh Kumar:
Smart memory. 1 - Ed Doller:
Forging a future in memory: New technologies, new markets, new applications. 1-28 - Tony Kim:
Managing the evolution of flash: beyond memory to storage. 1-35 - Aurangzeb Khan, Dan Lenoski:
Nonvolatile memory seminar Hot Chips 2010. 1-12 - Brad Taylor, Ralph Wittig:
28nm generation programmable families. 1-25 - Brian W. Curran:
IBM zEnterprise 196 processor. 1-31 - David Brash:
Extensions to the ARMv7-A architecture. 1-21 - Craig M. Wittenbrink, Emmett Kilgariff, Arjun Prabhu:
Fermi GF100 graphics processing unit (GPU). 1-27
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